

CMP Diamond Conditioners project is a project jointly participated by overseas and Taiwan experts or researchers with practical experience in semiconductor processing, ultra-precision processing, diamond coating, advanced materials and other fields. The original intention of the project is to realize the domestic substitution of the core technology of semiconductor manufacturing in China, especially the key consumables which have been monopolized by overseas companies. Among them, the CMP technology of the key process of wafer processing is the most important, and if the equipment of CMP process is compared to the heart of wafer processing, Diamond Conditioners products are as important as the pacemaker of the industrial heart. After years of experience, AIC's CMP Diamond Conditioners team members recommend and summarize the application features of the product: ● The design concept is a CMP Diamond Conditioners of metal-free construction. ● At present, integral, semi-integral and segmental structural designs are available. ● General design parameters can be used as reference indexes: 1: The outcrop point is a polyhedral cone structure, and the angle of the outcrop point is from 70 ° to 110 ° according to the customer's requirements; 2: that space between the cusps can be from 300-1000 μm; 3: The exposed height of the cusp is 10 μm-120 μm, or according to the customer's requirements; 4: that CVD diamond lay is generally 10-15 μm thick. 5: This innovative technology can effectively control the proportion of cone tip depth on the same Disk. For example, the outcrop rate at the depth of 120 μm is 40%, the outcrop rate at the depth of 100 μm is 30%, and the outcrop rate at the depth of 80 μm is 30%. ● Advantages compared with other similar products in the industry: 1: The particle size of CVD diamond is submicron to 3 μm, and even if the diamond layer is worn through, there is no risk of abrasive particles such as electroforming, brazing and polycrystalline diamond falling off; 2: The base material of Disk is ceramic + diamond coating material, which completely avoids metal ion pollution; 3. Through the ultra-precision processing of the Disk substrate, the flatness and the number of defects protruding from the sharp points are minimized, thus ensuring a stable removal rate in the use process; And 4, the height difference of the highest sharp point of the exposed polyhedron cone within 5 microns can be an effective point, and other processes can not be realized at all. 5. The effective exposure point can reach 60-70% even considering the micro-deformation factors in the diamond deposition process, while the products of other processes can only reach 10-20% according to the industry application data, especially the similar products of electroforming have only hundreds of effective abrasive particles in thousands or tens of thousands of abrasive particles. And 6, the same shape, structure and consistency of the polyhedral conical exposed point avoid the risk that the polishing pad is galled when the polishing pad is inserted into a product of other processes due to the occurrence of individual particularly prominent and sharp abrasive particle sharp points.

A sup (composite type binding agent) diamond grin head mainly used for processing ceramics, hard alloy and hard and brittle materials, and that service life of the product can reach dozens of times or even hundreds of times of that of the traditional electroplating grinding head.

As a glass cover or a glass sheet of a vision photoelectric system for an industrial robot which is mainly used in special industries under the action of diving or in a quicksand environment, the glass cover or the glass sheet is an accessory which needs to be replaced frequently due to abrasion, and under the condition that the glass sheet of the CVD diamond film coating pressure-resistant glass cover meets the light transmittance requirement, the diamond coating ensures the wear resistance of the product in the use environment, The service life of the product is greatly prolonged, the replacement frequency is reduced, and the use cost managed by the replacement of the component is greatly reduced.